Industry News | 2011-02-26 15:11:29.0
The newest version of GOEPEL electronic's AOI system software features a special highlight. An integrated debug statistics captures AOI relevant variations in the production process and provides them for statistical evaluations.
Industry News | 2013-10-09 08:35:53.0
SEHO Systems GmbH will exhibit in Hall A4, Stand #578 at the Productronica International Trade Fair in Munich, Germany.
SMTnet Express, August 31, 2017, Subscribers: 30,770, Companies: 10,706, Users: 23,739 NSOP Reduction for QFN RFIC Packages Mumtaz Y. Bora; Peregrine Semiconductor Wire bonded packages using conventional copper leadframe have been used in industry
SMTnet Express, November 9, 2017, Subscribers: 30,999, Companies: 10,789, Users: 24,027 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate Viktoria Rawinski; kurtz ersa Corporation Due to the ongoing trend towards
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
parameters such as solder mask, residues from PCBA assembly process, and PCBA layout and components have an influence on the water layer formation on PCBA surface and failures. Therefore it is fundamentally important to understand the influence of these
| https://www.smtfactory.com/electrostatic-discharge-ESD.html
? The impact of ESD on electronic components can be severe. The discharge can lead to irreversible damage, latent defects, or a reduction in the component's lifespan
