Industry Directory | Consultant / Service Provider / Manufacturer
SolderStar produce thermal profiler solutions for reflow soldering, selective solder machine profiling and wave solder optimization.
Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
These can be used to roll solder paste through the stencil aperatures for prototype printing. One set custom made for stencil size. At soldertools.net we supply numerous types of metal stencils including framed, frameless and prototype stencils. We
New Equipment | Solder Paste Stencils
Flip Up SMT Rework Stencils are laser cut solder paste stencils designed to replicate the intial manufacturing process albeit for a designated component or selected area. These laser cut mini stencils can either have flaps (to prevent neighboring are
Electronics Forum | Thu Oct 25 14:16:43 EDT 2007 | jsloot
Is anyone able to help me out on a typical aperture design for a castellated lead.
Electronics Forum | Thu Apr 12 09:13:41 EDT 2007 | aj
Hi all, What stencil aperture designs do you use for 0402 components? Thanks in advance for replies. aj...
Used SMT Equipment | Screen Printers
Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Parts & Supplies | Pick and Place/Feeders
NXT nozzle NXT-H01-7.0G (AA07300/AA07310) Spare Name: AA07300 AA07310 NXT-H01-7.0G Specifications Model: NXT NOZZLE Head H01 Dia 7.0G. FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800 F
Parts & Supplies | Pick and Place/Feeders
NXT nozzle NXT-H01-H02-1.3 (AA06812/AA06800) Spare Name: AA06812 AA06800 NXT-H01-H02-1.3 Specification: NXT NOZZLE Head H01 & H02 Dia. 1.3 FUJI NXT H01 PICK UP NOZZLE ¢ Applicable models: FUJI NXT H01 AA0AS00 FUJI NXT H01 1.0 AA05800
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2018-03-15 07:23:35.0
The SMT assembly process is continuously challenged by the factors which enhance circuit board performance and limit productivity. The pick and place and reflow systems reflect these driven issues by adding more and more controls to their systems, but the fact is one of the age old processes continues to operate within the same rules since the dawn of the SMT assembly world: The SMT screen printing. (...)This paper showcases a new stencil process that was discovered by reverting to the basics:understanding the reason for each stencil material process, focusing on detailed finishes and a disciplined aperture design process, maintaining original designs, and making the correctly designed apertures to control the paste deposition. The test results drove us to focus the efforts on the aperture walls In this paper we will demonstrate with lab tests SMT process results howthe improved paste release results in improved SMT print process performance and its positive impact on SPI yields and EOL performance.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Lumberton, New Jersey USA | Engineering
Reports to: Cad/Laser Manager Department: Cad Location: Lumberton Phone: 609-261-2670 Ask for Greg Starrett Email: Send resume as a word document or PDF to greg@metassocs.com Job Summary: Under the general supervision of the Cad Manager
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, March 8, 2018, Subscribers: 31,288, Companies: 10,911, Users: 24,465 Optimization of Stencil Apertures to Compensate for Scooping During Printing Gabriel Briceno, Ph. D., Miguel Sepulveda; Qual-Pro Corporation This study
SMTnet Express, April 16, 2020, Subscribers: 35,920, Companies: 10,989, Users: 25,757 Stencil Printing 008004/0201 Aperture Components Credits: ITW EAE This paper will focus on the application requirements of solder printing small aperture designs
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
Process and design-related causes-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Process and design-related causes Process and design-related causes
Heller Industries Inc. | https://hellerindustries.com/voids/
before it solidifies. Process and design-related causes of circuit board voids: Improper solder volume due to improper land design Improper solder volume due to blocked stencil aperture Improper solder volume due to improper stencil design Paste viscosity too low Paste metal
