Industry Directory | Equipment Dealer / Broker / Auctions
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
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Industry Directory | Equipment Dealer / Broker / Auctions
Buyer, Seller, Broker of Electronic Assembly Equipment
New Equipment | Test Equipment
Hanwha SM471 Plus SMT Assembly Line Hanwha SM471 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:78000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
New Equipment | Assembly Services
Hanwha DECAN S1 SMT Assembly Line Hanwha DECAN S1 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Electronics Forum | Tue Dec 15 23:20:44 EST 1998 | Dave
| Hello everybody: | somebody know about the formula to calculate the span for a particular component thougth hole, or an specific place where I can find this information. I have been looking at IPC manuals but I didn't find anything. | | any advise
Electronics Forum | Fri Nov 25 15:52:40 EST 2011 | davef
"IPC-2221 - Generic Standard On Printed Board Design" talks to fiducials. Anther take on fiducials says they shall meet the following requirements. * Make fiducials 1 - 1.5 mm diameter circle. * Cover fiducials with tin. * Keep solder mask opening at
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Good Service SMT Stencil Printer for PCB Assembly Line ❙ Introduce of SMT Printer ETA ETA-4034 is a high precision automatic solder paste printer, correspond to industrial 4.0 and MES system.through a higher level of automa
ETA NEW Fully Auto SMT Stencil Screen Printer for LED ❙ Introduce of SMT Printer ETA ETA-4034 is a high precision automatic solder paste printer, correspond to industrial 4.0 and MES system.through a higher level of automation, ac
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Best Practices for High Mix Low Volume PCB Assembly
Events Calendar | Tue Dec 11 00:00:00 EST 2018 - Tue Dec 11 00:00:00 EST 2018 | ,
Best Practices for High Mix Low Volume PCB Assembly
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Operator in our Lighting Manufacturing facility in Racine, Wisconsin. Location: Racine, WI Shift: 7AM - 3PM (Monday - Friday) Full-time w/benefits! Summary: This person will be a primary contribut
Career Center | Glendale Heights, Illinois USA | Engineering,Production
Surya Electronics inc seeks a professional, innovative and detailed individual for our Process Engineer position. If you are looking for an opportunity to work in a fast-paced, manufacturing facility, then this challenging position is for you! Respo
Career Center | , | 2013-01-31 04:29:34.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
Career Center | , | 2013-01-31 04:45:28.0
• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010
The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards Universal Instruments Credit/Source: Jay B. Hinerman, K. Srihari, Ph
SMTnet Express, October 6, 2016, Subscribers: 26,499, Companies: 14,980, Users: 41,213 Figure 1-An IoT PCB Using Rigid-Flex Construction PCB Laser Depanelizing Using a UV Laser Bob Wettermann; BEST Inc. One of the methods gaining in popularity
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_throughhole-padstack-roundoff_topic982.xml
; Is there another place to set it? Through-hole Padstack Round-off : Pad stacks generated for the FP... Author: Jeff.MSubject: 982Posted: 30 Jul 2013 at 8:36amPad stacks generated for the FP designer are created directly in the Pad Stack Designer when you create the pad stacks you're going to use in your
Lewis & Clark | https://www.lewis-clark.com/product-tag/through-hole-selective-solder/
Through Hole Selective Solder Archives - Lewis and Clark, Inc. Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal
A dealer of high quality Used SMT Equipment, Used Plastic Injection Molding Equipment, Used Machine Tools, Used Semiconductor Machinery, and Used Industrial Machinery.
Equipment Dealer / Broker / Auctions
104 East Street
Middleton, MA USA
Phone: 978 790-2774
