Industry Directory | Manufacturer
Our products had been widely used in mechanical and electronic industries, etc. Our main products include: 1. Diwei Stone wave solder pallet material: with black, gray, blue and red colors, etc. 2. Glass Fibre pallet: 3241 semiconductor pallet, epoxy pallet, lead-free pallet, insulating pallet, high temperature resistance pallet, copper clad pallet, linen face pallet, etc. Looking forward to
Industry Directory | Distributor / Manufacturer / Other
Digvijay Metals are manufacturers, suppliers of stainless steel glass spigot, glass bracket, glass fittings, glass clamp, slotted pipe, decorative profile, gate roller wheel, stainless steel grill, ss railing manufacturers.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Fri Jun 06 16:11:25 EDT 2003 | RF Lurker
I understand that there may not be a lot of material on this, as most threads I've seen discourage doing it. It goes against DFM to do it. But I wish to use a large copper area instead of heat sink and thermal epoxy to cool a regulator. But I can'
Used SMT Equipment | AOI / Automated Optical Inspection
Dimensions 800 W x 1280 D x 600 H mm (31.5 W x 50.39 D x 23.62 H in.) (* ) Weight Approx. 175 Kg (385.8 lb) PCB Size 50 W x 50 L - 460 W x 500 L mm (1.97 W x 1.97 L – 18.11 W x 19.69 L in.) PCB Thickness 0.6 - 2
Used SMT Equipment | Adhesive Dispensers
Fuji GL541E *Basic Specifications Cycle time 0.09 seconds/dot Travel distance - X-axis within 8mm Y-axis within 6mm Needle up/down distance of 8mm Application time: 0.05 seconds Dispensing accuracy: +/- 0.15mm in th X and Y directions (3 sigma)
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | Assembly Accessories
J90650281B Samsung SM421 Feida Accessories 8MM 12MM 16MM Feida Power Cord J90650279B Samsung CP45 placement machine 8MM 12MM 16MM 24MM Feida small plastic wheel one-way bearing J1301606 Samsung SMT CP40LV 45FVNEO Feida CP8X2mm 8X4MM long tail new F
Parts & Supplies | Assembly Accessories
COVER X01M1509901 JET STREAM TUBE T32/SPOUTING BATH COVER 13294 TOP COVER-R12 2AGGHB001803 CAMERA COVER AA17700 Bank cover 40001750 COVER,COPPER N210103441AA Cover screw CSSX0030 Cover plate
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
Technical Library | 2022-01-26 15:26:56.0
In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity.
Nano-copper sintering in formic acid vapor.
Features ●Suitable for high hardness aluminum, copper LED strip PCB. Two PCBAS can be separated at a time (ML-360B). ●Applicable PCB material:Aluminum,Copper,etc. ●Manually feding and precise positioning to separate PCBA. ●Progressive separation of f
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
– Laminates consist of prepregs and foils that have been laminated and cured together with heat and glass. These can be made out of a variety of thicknesses and different types of epoxy and glass waves. Solder Mask
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