Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
The PCB Depanelers more detail and video please check the link: www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com This machine can use for all kinds of PCB board. 1. Cutting with the double straight knives,
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Electronics Forum | Tue Aug 17 10:37:45 EDT 2004 | M.Enright
Some cracks are really obvious,straight down the middle of the capacitor.Some are slight hair line fractures which fail at ICT.In all cases seen,all cracks are through the centre of the cap.My worry is that there may be some which have fractures and
Electronics Forum | Fri Oct 22 11:04:29 EDT 2004 | Simon UK
I have experienced this same problem with CECC Type caps, in all sizes. One cause, which may have not been explored is the component may hav been cracked before you placed it 1 in 300? Hmm..I did this on our products that were showning atleast 5 per
Used SMT Equipment | AOI / Automated Optical Inspection
Non-blind spot digital 8 projection moiré 3D inspection technology Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting Smallest componentinspection by ultra-high resolution camer
Used SMT Equipment | AOI / Automated Optical Inspection
MV-6e SeriesThe world’s best 2D AOI system The world’s best performance 2D AOI – Small component inspection up to 0201(㎜) size with high resolution 18 mega pixel CXP camera & 7.3㎛ lens– Inspection for diffuse reflection component, OCR, micro crack pr
Industry News | 2010-08-04 21:04:22.0
Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/automated-optical-inspection-systems?con=t&page=26
. Nordson DAGE bondtesters are providing the industry with manual and fully automatic solutions for… Modern 2D X-ray Tackles BGA Defects Nordson DAGE TSOP CRACKED DIE Nordson SONOSCAN TSOP Cracked Die - Application Note 759 Hanzhuang Liang High Throughput Precise Dotting_Whitepaper Nordson Corporation Unity™
Imagineering, Inc. | https://www.pcbnet.com/blog/circuit-board-repair/
. Learn how they happen and about your circuit board repair options. PCB Components A marvel of modern technology, a printed circuit board (PCBs
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