Industry Directory | Consultant / Service Provider
Consultant. Electronics Manufacturing Solutions provides Hands on Experience for Real World Solutions.
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
Electronics Forum | Wed Jan 15 03:06:15 EST 2020 | SMTA-Davandran
Hi anyone, have standard design guideline for all type of components.
Electronics Forum | Wed Jan 15 06:58:51 EST 2020 | dontfeedphils
http://www.ipc.org/TOC/IPC-7525.pdf Best place to start.
Used SMT Equipment | In-Circuit Testers
Yokogawa PZ4000 253710-D-M3 Power Analyzer The Yokogawa PZ4000 (253710) lets you make high-precision measurements of voltage, current, and consumed power in equipment driven at frequencies ranging from several tens of kHz to approximately 100 k
Industry News | 2003-04-14 08:50:52.0
Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.
Industry News | 2013-07-31 07:28:30.0
Today, the electronics manufacturing industry’s first design guidelines for printed electronics, IPC/JPCA-2291, Design Guidelines for Printed Electronics, was released by IPC — Association Connecting Electronics Industries® and JPCA.
Technical Library | 2007-01-17 13:08:35.0
Researchers at Washington State University have created design guidelines for new molecules that could enhance the speed of internet communications and other optical technologies.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Career Center | Lynchburg, Virginia USA | Engineering
Engineer must conceive, develop and implement the processes, techniques and specify equipment required to manufacture & maintain high quality printed circuit board assemblies. Take a leadership position in providing guidance for other Process Enginee
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 5+ years in complex electronic sub-assemblies and of SMT assembly practices. Strong in DFM, DFT, ECO, BOM. Kn owledge of CAD (schematic capture, layout) PC, and Unix. People skills. Duties/Functions: Provide technical support
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
Sponsors About This Newsletter The SMT Express is a periodical featuring assembly solutions from your peers and vendors. We, at SMTnet.com , have designed this newsletter to bring useful information to the mailboxes of electronics
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/process-troubleshooting-guide
. The guidelines expressed in this document are intended to be general in nature and are influenced by the design aspects of printed circuit boards, thermal mass of through-hole components, various
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
. Course registration includes breaks, course materials, and a Certificate of Attendance. SUNDAY, September 22, 2019 PDC01 Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits Vern Solberg, Solberg Technical Consulting Sunday, September 22 | 8:30am — 12
