Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Industry Directory | Manufacturer
Development and manufacturing of X-ray based inspection systems.
Our edge-hardened, pre-sharpened knife steel, which we refer to it as �Presharp,� is a high technology, lead-hardened steel that has revolutionized the die-making process. One of Austria�s oldest and most respected steel mills developed a unique proc
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef
What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Used SMT Equipment | Visual Inspection
2007 Fein Focus Cougar XRAY System Complete & Ready for Delivery! 160kV Microficus Demountable Open XRAY Tube With Transmission Target (2um Resolution) Maximum Sample Size: 17" x 21" Maximum Inspection Area: 12" x 12" Ergonomic Workstation W
Used SMT Equipment | X-Ray Inspection
Configuration Complete X·ray Protection Cabinet With Safety Interlocks 160 Kv Microfocus Demountable Open X-ray Tube Transmission Target (-500 Nanometer Resolution} True X-ray Intensity (Txi) Control 10 Watts Target Power Qty.6 -
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
FPC / PCB Punching Dies PCB Depaneler For High Volume Boards Singulation Advantages: 1. Pneumatic, environmental protection 2. High efficiency, suitable for high volume PCBs 3. Security door protection, ensure safe production Features: 1. D
Flexible PCB Board Cutting Machine PCB Punching Machine With Cutomized Die Tooling PCB Punching Machine Features: 1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Die toolings is changeable 3. Easy set
Career Center | South Plainfield, New Jersey USA | Sales/Marketing,Technical Support
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Laguna, Calabarzon Philippines | Engineering,Maintenance,Production,Technical Support
Base on my experience more on line sustaining and preventive maintenance in equipment and testing machine for electronics and semicon company Some slight skills in surface grinding,soldering and LAN connection and installation. Can submit report
| https://productronica.com/de/messe/ausstellerverzeichnis/leitthemen/sensoren-elektronikfertigung/
Störungssuche, Prozessanalyse, beim Condition Monitoring oder Energiemanagement. Mensch-Roboter-Kollaboration (MRK) Aufgrund der hohen Anforderungen an die Sicherheit des Menschen sind Roboter meist leistungs- und kraftbegrenzt
| https://www.eptac.com/wp-content/uploads/2013/08/eptac_08_21_13-1.pdf