Industry Directory | Manufacturer
As a global specialist in energy management with operations in more than 100 countries, Schneider Electric offers integrated solutions across multiple market segments.
Headquartered in Monrovia, CA, Falcon Electric, Inc. is a leading provider of UPSs, frequency converters and voltage regulators that serve a wide range of applications for government, medical, financial, telecom, computer and other industries.
New Equipment | Board Handling - Conveyors
Model No: KSUN 250 Automatic un Loader PCB loading time: Approx 6seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 10L/minute Transport height: 900±
New Equipment | Board Handling - Conveyors
product instruction ※PLC control system, Working is stably and reliably ※Easy to operate touch screen control interface ※the pneumatic clamps of top and bottom three point provided for the magazine alignment ※Electric pushing board design ca
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Fri Jan 13 14:18:41 EST 2006 | mark
Hi, I would like to ask you how you test the PCB (electrical test) of first PCB before starting production.? What kind of equipment you are using? and method to confirm that components on PCB are correct (value, orientation, describtion, polarizatio
Used SMT Equipment | Pick and Place/Feeders
Performance One-Side Operation The single-cantilever, single-rail structure optimizes the production area and manpower efficiency of equipment that uses only one side of the machine Flexible Production Capable of handling long substrates up to 1,50
Used SMT Equipment | Soldering - Reflow
Reflow welding machine is a very important equipment in SMT production process. Reflow welding process directly affects the quality of SMT process. It is difficult to achieve good reflow welding quality without a good reflow A welding machine. [1]
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Model NO. : GW-UL250L , GW- UL330L ,GW- UL390L ,GW- UL460L PCB size(L×W)~(L×W) :(50×50)~(350×250),(50×50)~(455×330),(50×50)~(530×390),(50×50)~(530×460), Machine size (L×W×H) : 1370×750×1200 , 15
Parts & Supplies | Pick and Place/Feeders
Name of equipment: Samsung SM421, Samsung SM421 mounter, used Samsung SM421 mounter The latest arrival of Samsung SM421 mounter 18, 12-year machine, color state is excellent, welcome to buy! ! ! Brief introduction of equipment Samsung SM421
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
Events Calendar | Sat Jul 06 00:00:00 EDT 2019 - Sat Jul 06 00:00:00 EDT 2019 | Chennai, India
Reliable Electronics for the Automotive Industry Technical Workshop
Career Center | San Jose, Nationwide | Engineering,Management
This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | La Crosse, Wisconsin USA | Maintenance,Production,Quality Control,Technical Support
Ability to read,comprehend and troubleshoot ele- ctronic components using blue prints or schema- tics.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
in Microelectronics : Materials, Processes, Reliability, an
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