Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications. Incorporating over 15 years of jetting experience, the DJ-9500 jet provides even more capability than its DJ-9000 predecessor. Nordson ASYMTEK's jettin
Electronics Forum | Wed Aug 13 21:03:01 EDT 2003 | davef
Your dust collection / humidity / ionic path concern is reasonable. Consider applying your conformal material thick enough to form a good barrier between the device edge and the board, similar to what you do for QFP. [Admittedly the QFP is not a pre
Electronics Forum | Thu Jan 27 21:43:35 EST 2022 | williamaxler
Take the 2 screws out of the pitch plate and flip it over.
Used SMT Equipment | Pick and Place/Feeders
Universal GSM2 with maximum upgrades to replicate the GX-11 capabilities at a fraction of the cost. Basically a one machine factory. Some features are: * 7 Spindle FlexJet head on Beam 2 * 4 Spindle FlexHead on Beam 1 * UPS+ Windows software
Used SMT Equipment | Pick and Place/Feeders
Universal GSM2 with maximum upgrades to replicate the GX-11 capabilities at a fraction of the cost. Basically a one machine factory. Some features are: * 7 Spindle FlexJet head on Beam 2 * 4 Spindle FlexHead on Beam 1 * UPS+ Windows software
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2003-03-28 08:24:43.0
The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.
Parts & Supplies | Pick and Place/Feeders
SM321J9060357B HEAD OUTER LED BOARD ASSY AM03-005581A CABLE ASSY-Z6-Z10_HOME_SEN J67111137A FITTING KQ2L04-06 J6711250A BARB FITTING[M-5AU-2] J90600059C J91741047A - CAN_MASTER_BOARD_CP45 VER 1.1 J9065258A VINYL SHAFT 44 RIVET ASSY[SM1-MF44-026
Parts & Supplies | Pick and Place/Feeders
SM320 J9060337B HEAD VACUUM SENSOR SUB BOARD AM03-005581A CABLE ASSY-Z6-Z10_HOME_SEN J67111137A FITTING KQ2L04-06 J6711250A BARB FITTING[M-5AU-2] J90600059C J91741047A - CAN_MASTER_BOARD_CP45 VER 1.1 J9065258A VINYL SHAFT 44 RIVET ASSY[SM1-MF44
Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
High Quality SMT Handling Equipment PCB Flipper Inverter Conveyor Product introduction: 1.Stable and reliable PLC control system 2.Easy to operate LED touch screen control interface 3.Using cylinder flip, quick, smooth, precise alignment(o
Hanwha SLM100 High-Speed Smart LED Chip Mounter If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
Events Calendar | Wed Dec 01 00:00:00 EST 2021 - Wed Dec 01 00:00:00 EST 2021 | ,
Wine Down Wednesday: Driving Innovation through Intrapreneurship
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Determining Thermomechanical Reliability of Flip Chipped SiC Power Device Assemblies
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Career Center | , | Engineering,Technical Support
COMPETENCIES & SKILLS : Proficient in SMT chip Mounters and IC/Flip chip Placers like Assembleon, Panasonic, Yamaha & etc. Experienced in handling Screen Printers like Minami, Dek, Panasonic and semi-automatic Printers. Expert in Camalot
SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
| https://www.eptac.com/blog/from-flip-to-flat-to-foldable-5g-smartphone-market-trends
From Flip to Flat, to Foldable 5G—Smartphone Market Trends Looking for solder training standards, manuals, kits, and more? Visit
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/advanced-features/waterplume-transducer
. The WaterPlume inverted scanner couples the ultrasonic transducer to the part from underneath, eliminating the operator’s need to flip the product over when loading the machine
