Industry Directory | Manufacturer
Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.
Industry Directory | Manufacturer
Asahitec offers high precision and high quality products guaranteeing only the best in photoengraving and imaging technologies. Asahitec offers world class products without compromising on quality and is respected by customers.
New Equipment | Assembly Services
Premium Automatic PCB Support for SMT Processes Ovation’s award-winning Grid-Lok Gold™ automatic substrate support technology provides electronics manufacturers with a robust alternative to costly and often problematic dedicated fixture plates. Set
New Equipment | Education/Training
Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.
Electronics Forum | Tue Feb 28 12:34:12 EST 2006 | pr
Gel flex is crap! If you put enough in to actually support the board, it bows. Apparently MPM knows this because they include hard pins with the set (kinda defeats the purpose huh)! I trialed the grid-lok and it worked fine and operators loved it. Th
Electronics Forum | Tue Feb 28 11:15:20 EST 2006 | billyd
In my last life we had pretty good luck with the Grid-lok system. Just not very good for extremely large boards, or very thin ones. (Tends to push thin ones up and bend them before the table rises. **On DEK printers, mind you) Form-flex was a nightma
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Used SMT Equipment | Screen Printers
Software version: 09SP13P02 Details: • Green Camera • Under Stencil Wipe • Vacuum • Edge Clamping • Grid Lok® Ready
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2016-10-03 08:28:47.0
With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper.
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | TULSA, Oklahoma USA | Engineering,Production,Purchasing,Research and Development
This opportunity is with a global industry leader designing and manufacturing sophisticated electronic assemblies and sub-assemblies. These products play a very significant role throughout the world providing essential equipment and components to the
Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing
PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC
Career Center | new delhi, India | Engineering,Technical Support
Dear Sir/Madam, I would like to take this opportunity of introducing myself to you. I am Software Developer. Presently I am working with Autometers Alliance Ltd. and looking for a better option that gives me a platform where I can utilize my techni
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_universal-grid-system_topic2404.xml
designs.I’m using 50um grid system down to 0402 (imp.) chip component sizes without issues but creating symmetrical and evenly dividable patterns for proper placement (including courtyard
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/solve-consistency-issues-with-automated-conformal-coating-inspection
Solve Consistency Issues with Automated Conformal Coating Inspection ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
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