New Equipment | Test Equipment
Absolute Test Advantage (ATA) offers Absolute's customers extensive test capabilities. Just some of the state-of-the-art equipment is: ICT HP 3070 JTAG Technologies ProVision Development Station Takaya APT84XX Flying Probe In-Circuit Tes
Amfax a3Di is not an AOI (Automated Optical Inspection) system. It is a revolutionary laser based metrology measurement system that enables you to find faults on your populated PCB assemblies like never before. The extremely accurate measurement capa
Electronics Forum | Thu Jul 20 07:40:56 EDT 2006 | ev
I have a TP11 UFP without the hydra option and have had difficulty keeping it running. The latest problem is a hardware iniation problem which in the past was a PAIB board failure which I replaced about one year ago almost to the day. Has anyone seen
Electronics Forum | Thu Jul 20 10:48:43 EDT 2006 | pms
Ev, This error could be caused by any number of problems. Is there an error message in the message window before hardware initiation error? If so, what is it? A failure in any axis (x,y,z,c,theta,y-wagon,tray-wagon) could cause your symptom. Paul
Used SMT Equipment | Pick and Place/Feeders
Software: 2.9.x T3 Linear Table Electrical Two-Pole Test Electrical Transistor Test Optical Centering Conveyor Shared Databases Hydra Z High Speed Hydra High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence
Used SMT Equipment | Pick and Place/Feeders
2004 Mydata MY 12 SMT Pick and Place Power: 210 / 121VAC; 3 Phase Machine Dimensions: 132" x 48" x 60" Features: Electrical two-pole test Optical Centering HYDRA; HYDRA High Speed Z High Speed; Autoteach Line Scan Software Version 2.4.6b
Industry News | 2013-04-15 15:16:28.0
Ascentech LLC, North American Distributor for UK-based Aprotec Instrumentation, announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use benchtop non-contact SPI measuring systems capable of meeting the needs of today's demanding PCB production and assembly environment.
Industry News | 2013-06-27 08:49:03.0
Chester, Connecticut, USA – Ascentech LLC, North American Distributor for UK-based Aprotec Instrumentation, announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use benchtop non-contact SPI measuring systems capable of meeting the needs of today’s demanding PCB production and assembly environment.
Parts & Supplies | Pick and Place/Feeders
JUKI 2050 machine failure solution KE2050M Z-axis fault E620014 error handling method! Suddenly heard the sound of the machine. The machine stopped the fault for the E620014Z axis drive alarm. View the drive. For Z drive 1, the third light is on
Parts & Supplies | Component Packaging
Flow sensor PFMV530F-1-N-X518B N510068515AA for Panasonic NPM Machine MTNS000432AA Flow Sensor N510048693AA Flow Sensor N510058280AA Flow Sensor N510067405AA Flow Sensor KXF0DWW9A00 CONVERY MOTOR N510048981AA KXF0DGEAA00 R MOTOR 3W N510
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Career Center | Santa Ana, California USA | Engineering,Quality Control
General Purpose: This position for a Quality Engineer must have electronics manufacturing and/or cable experience. Your electronics manufacturing background, PCBA, cabling experience, and expertise in auditing and maintaining AS9001 will be the keys
Career Center | Clifton, New Jersey USA | Engineering,Production
L3Harris is seeking an engineer to lead manufacturing and space vehicle integration related activities on the GPSIIIF and NTS3 program. The type of space flight hardware produced at this L3Harris location includes complex circuit card assemblies (CCA
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Riyadh 11623, Philippines | Engineering,Maintenance,Production
PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
| https://pcbasupplies.com/product-tag/juki-smt-nozzles/page/6/
: high to low Custom Micronic/Mydata Midas Melf Tool for large blue arrester [2011-0906] $ 345.00 Add to cart Custom Mydata Hydra Nozzle with plastic tip for Kingbright KPTD leds [2015-2453
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate
. This is done by screening combinations of solder ball alloys and under bump metallization for various industry standard failure modes by identifying the presence of voids at the UBM interface that
