Electronics Forum: imc oxygen (1)

looking for HASL TIN thickness specification

Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster

At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera

Express Newsletter: imc oxygen (24)


imc oxygen searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t net
  1 2 3 Next
Circuit Board, PCB Assembly & electronics manufacturing service provider

Reflow Soldering 101 Training Course
PCB Handling with CE

Stencil Printing 101 Training Course


Best Reflow Oven
High Throughput Reflow Oven

High Throughput Reflow Oven
Assembly Automation Technology

"回流焊炉"