Most complete line of industrial grade Ion Selective sensors for process monitoring and/or control. Interactive effects of pH upon ion concentration can be compensated via our interative dual channel transmitters (HF, HCN, Ammonia, Calcium... et. al
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Mon Sep 20 04:50:24 EDT 1999 | Brian
| | | | | | | | I am not familiar with the "mil" metric. How many inches is in 1 mil? | | | | | | | | | | | | | | | | ...or 10 mil? | | | | | | | | | | | | | | | | | | | | | | | 1 mil= .001 inches | | | | | | | 10 mil= .010 inches | | | | | | | A
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz CMW500 loaded with options Wideband Radio Communication Tester Rohde & Schwarz CMW500 LTE FDD CDMA2000 1XEV-DO with the following configuration: CMW500 Hardware Options Included: H051F/H052F/H054B/H055H/H090A/H100A/H110A/H200
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz CMW500 loaded with options Wideband Radio Communication Tester Rohde & Schwarz CMW500 LTE FDD CDMA2000 1XEV-DO with the following configuration: CMW500 Hardware Options Included: H051F/H052F/H054B/H055H/H090A/H100A/H110A/H200
Industry News | 2014-05-19 14:11:04.0
HMC Electronics will now offer clients free shipping on InterMetro orders totaling $1,500 or more.
Industry News | 2007-06-22 11:43:27.0
Richardson, TX (June 19, 2007) � A new edition of the popular Boundary-Scan Tutorial from ASSET InterTech Inc., (www.asset-intertech.com) an international leader in boundary-scan (JTAG/IEEE 1149.1) test and in-system programming (ISP), includes expanded explanations of how to use JTAG as well as totally new sections describing complementary technologies such as the new IEEE 1149.6 Boundary-Scan Standard for Advanced Digital Networks and the IEEE 1532 In-System Configuration Standard.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
SMTnet Express, March 15, 2018, Subscribers: 31,317, Companies: 10,908, Users: 24,499 SMT Stencil, Surface Performance Returning to Basics in the SMT Screen Printing Process to Significantly Improve the Paste Deposition Jim Villalvazo; Inter
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID.pdf
“Generic Standard on Printed Board Design” and IPC-2222 “Sectional Design Standard for Rigid Organic Printed Boards”. The program covers guidance and requirements for printed board assembly and design parameters from component mounting, inter- connecting structures, conductor characteristics, surface finishes, board
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/efd/solutions/rfid
essere apposto su un oggetto e usato per monitorare e gestire l'inventario, le risorse, il personale e così via. Smart card a doppia interfaccia Il mercato delle smart card a doppia interfaccia (DI) è
