Electronics Forum | Mon Aug 30 14:32:52 EDT 2010 | davef
Steve: Yes, you shall bake prior to thermal cycling. You should be able to download J-033 from JEDEC [ http://www.jedec.org/standards-documents ]. You want "Paragraph 4 Drying." While it's aimed a component parts and not assemblies, J-033 is as goo
| https://pcbasupplies.com/bloghumidity-controlled-storage-cabinets-expo/
. These storage cabinets satisfy standards such as IPC/JEDEC J-STD-033 and IPC/JEDEC J-STD-020. Southwest Systems Technology is the leading manufacturing resource for the Southwest
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5101
solderable surface mount device connectors. The previous work presented estimates for floor life (as defined in IPC/JEDEC J-STD-033) based on conservatively assumed maximum moisture content thresholds below which these materials should readily survive the solder reflow process
