Industry Directory | Manufacturer
Provider of microcontroller, analog, memory and Flash-IP solutions, providing low risk product development, lower total system cost and faster time to market for customer applications worldwide
Dataman have over 20 years experience of manufacturing and supporting microchip programming equipment. We are responsible for the best-selling S4 handheld programmer/emulator.
Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
Hanwha DECAN F2 Pick and Place Machine High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Hanwha DECAN F2 Pick and Place Machine High Speed SMT Modular
Electronics Forum | Fri Jan 15 09:18:28 EST 2016 | whitewing
If you're using Microchip parts, Microchip can supply ready programmed (and marked) via Microchipdirect. Some distributors also offer programming services
Electronics Forum | Wed Mar 17 21:05:01 EDT 2021 | action_101
In need of some Microchip LAN9311-NU and the market is killing us, 4-6 weeks out, production down. If anyone has some of this component unopened in the package and would be willing to sell, please let me know.
Used SMT Equipment | Pick and Place/Feeders
Flexible Production High PCB handling capacity in a medium speed bonder 510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1,500mm(L) x 460mm(W) size can be produced High Reliability Stable mounting of microchips Automatic calibration is perf
Used SMT Equipment | Chipshooters / Chip Mounters
Samsung chip mounter SM-421 Advanced Flexible Mounter Using the vision system which is upgraded from the SM421 vision system, the SM421 can be applied to parts from 0603(0201) microchip to □22mm IC part through On-The-Fly reco
Industry News | 2022-03-03 16:21:56.0
During his State of the Union address tonight, U.S. President Joe Biden is expected to urge Congress to pass much-needed funding for semiconductor manufacturing and other advanced technologies as part of a new competitiveness measure. Both the House- and Senate-passed bills include $52 billion in funding as well as additional measures to boost American R&D, which will help reestablish the United States as a global leader in building the technologies of the future. IPC applauds President Biden's continued focus on the semiconductor shortage and his ongoing efforts with Congress to finalize the "USICA/America COMPETES" legislation.
Industry News | 2018-10-18 11:18:14.0
Making Readable Silkscreen Layouts for your Printed Circuit Board (PCB) Design
Parts & Supplies | Circuit Board Assembly Products
ATXMEGA32D4-AUR Microchip Technology ATXMEGA32D4-AUR Microchip Technology PIC16F913-I/SS Microchip Technology PIC16F887-I/ML Microchip Technology ATMEGA16A-AUR Microchip Technology ATMEGA16A-AUR Microchip Technology ATMEGA16A-AUR Microchip Tech
Parts & Supplies | Other Equipment
SMT Parts PANASERT Nozzle BM221 PANASONIC SMT Nozzle 1.Model PANASERT BM221 2.For PANASERT placement machine. 3.Uninterrupted operation 4.Tip made by Diamond steel 5.No.10807GH11AA 1.Panasonic's BM modular high speed multi-functio
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2014-08-19 16:07:15.0
Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs.
Panasonic NPM-W2 Modular SMT Chip Mounter Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Chesterland, Ohio USA | Engineering
Principal Electronic Engineer IV Position Overview We currently have an excellent career opportunity for a Principal Electronic Engineer (IV) to join our engineering department team at our Channel Products, Inc. facility in Chesterland, OH. This
Career Center | lagos, Nigeria | Maintenance
CHEVRON OIL AND GAS LIMITED NO 8 MACARTH STREET VICTORIA ISLAND LAGOS/NIGERIA CHEVRON OIL AND GAS LIMITED intends to Invite experienced and reputable persons having prime experience and capable of providing services of a plumber(as individuals or
Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development
Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Brent Fischthal, Michael Cieslinski; Panasonic Factory Solutions Company
Conductive adhesives increase microchip packaging density Conductive Adhesives Increase Microchip Packaging Density Interconnecting microelectromechanical systems directly to printed circuit boards can improve reliability and reduce costs
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pod-my-observations_topic1795.xml
. Manufacturer Change % Vishay 300838 58.4% Susumu 32546 6.3% Stackpole Electronics 30999 6.0% API Delevan 25272 4.9% Microchip 19208 3.7% CTS 17448 3.4% TDK 13702 2.7% ST Microelectronics 11021
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