BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Fri Jun 18 13:20:42 EDT 2004 | jdumont
Thanks a lot. Actually, you are our local rep for AIM. Do you offer any services such as coming down to RI to set up a profile or anything of that nature? We currently use AIM 256 and the wetting isnt as good as I would like to see. Thanks JD
Used SMT Equipment | Pick and Place/Feeders
Philips CSM Eclipse II with CSM Tray Feeder 1997 Vintage Type PA130810 Nc 946601308101 No FF00700Y10037 200-240V 4KVA 50/60 Hz Air 0.5MPa CSM Tray Feeder 1996 Vintage Type PA269921 Nc 946602699211 No FF00710Y10034 Stick: Depends on stic
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
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Parts & Supplies | SMT Equipment
03047697-01 Machine controller MicroBox 420 V2 03047752-02 Inrush-current limiter 03047765-01 Transport Lock long asymmetrical compl 03047768S01 12-segm. C+P head DLM3 / w.out sleeves 03047822-01 VACUUM NOZZLE VADM-200 03047845-01
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Parts & Supplies | SMT Equipment
03047845-01 Cable /s-D Placementhead 03047943S01 FCCS digital 03047976S01 Cable / splice detect TC / TC-sockets 03047984-01 Vision Board Spread Spectrum X (VBSX) 03048001-02 CPU-Bg. SMP16-CPU086 1,6GHz 256MB 03048005-01 Servo amplifier TBS200/3Z
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
03047697-01 Machine controller MicroBox 420 V2 03047752-02 Inrush-current limiter 03047765-01 Transport Lock long asymmetrical compl 03047768S01 12-segm. C+P head DLM3 / w.out sleeves 03047822-01 VACUUM NOZZLE VADM-200 03047845-01
03047845-01 Cable /s-D Placementhead 03047943S01 FCCS digital 03047976S01 Cable / splice detect TC / TC-sockets 03047984-01 Vision Board Spread Spectrum X (VBSX) 03048001-02 CPU-Bg. SMP16-CPU086 1,6GHz 256MB 03048005-01 Servo amplifier TBS200/3Z
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Phoenix, Arizona USA | Engineering,Quality Control
DESCRIPTION Develop and improve quality systems and processes. Will work to reduce waste and process related defects. Will work with quality, design, and test on DFx and NPI. Customer contact for quality issues and new product launch. New equip
Career Center | , Florida USA | Engineering,Production
� Will develop, implement, and maintain PCB assembly processes including screen printing, placement, reflow, and automated optical inspection. � Will work with quality, design, and test on DFx and NPI. � Identify opportunities and drive implementati
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