Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
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pcb assembly,pcb manufacture,printed board pbc Industrial Control Interface Board PCBA GTA-002 Catalog:pcb, pcb assembly,pcb manufacture, printed circuit board, pcb supply, pcb boards, electrical.suppliers. Raw Material: FR4 Finish: ENIG/ OSP/ H
FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
Electronics Forum | Thu May 04 16:00:07 EDT 2000 | Nick
A Machines reliability will remain the same If it places 25 parts or 25,000 parts. It has nothing to do with "how many parts" but on the repeatability of the machine type. You would notice less misplacements on a low count PBC due to seeing less comp
Electronics Forum | Tue May 16 13:53:19 EDT 2006 | patrickbruneel
Hi Rob, Don't feel sorry I like these discussions make us think more thorough. This is the supporting scientific paper they used in support of the exemption request. Effects of lead on tin whisker elimination By Wan Zhang and Felix Schwager. http:
Industry News | 2003-05-16 08:23:59.0
A novel PCB socket block features integrated crossconnections, which facilitate daisychaining of supply voltage and signal lines in multiboard applications, saving installation time and money.
Industry News | 2007-10-29 16:48:09.0
At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.
Parts & Supplies | Pick and Place/Feeders
available for sale, please contact us for Photos and quotes, if you have interest. Thank you wendy Email: wendy@leadersmt.com skype: Leaderway-Miss xiao Tl/whatsapp:+86 13148795469
Parts & Supplies | Pick and Place/Feeders
available for sale, please contact us for Photos and quotes, if you have interest. Thank you wendy Email: wendy@leadersmt.com skype: Leaderway-Miss xiao Tl/whatsapp:+86 13148795469
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
MB-Mfg's pallet in use.
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