Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
US based manufacturer of burn-in and test sockets. Wide range of BGA, QFP, QFN, PLCC and other sockets. All products made in the USA.
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Electronics Forum | Fri Jul 19 22:26:32 EDT 2019 | dhanish
Thanks Dave..What is the voids spec for QFN?This is another challenge with the QFN's
Electronics Forum | Thu Nov 15 09:29:03 EST 2007 | jaimebc
Just to add to the subject, we experienced insufficient solder on our QFN's at our prototype level. To correct it, we went to a 5 mil stencil, 20% reduction on QFN pertures and used QFN's with solder bumps on the pads. We had great results using thi
Used SMT Equipment | Screen Printers
DEK Horizon 03i automatic stencil printer Specification : DEK Horizon 03i High Precision Automatic Solder Paste Printer designed for high precision steel mesh printing or stencil printing in SMT industry. Printing PCB size: 50x50mm to 508x510mm;
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Parts & Supplies | SMT Equipment
Juki 2050 2060 503 504 nozzle Description: Brand:JUKI Nozzle model:500 501 502 503 504 505 506 507 508 Application:Juki 2050 2060 smt machine Customize:yes Advantage: 1.The juki nozzle core is different, it suitable for RC, varicap, SOT, QFN
Parts & Supplies | SMT Equipment
Juki 505 506 nozzle for 2050 smt machine Description: Brand:JUKI Nozzle model:500 501 502 503 504 505 506 507 508 Application:Juki 2050 2060 smt machine Customize:yes Advantage: 1.The juki nozzle core is different, it suitable for RC, varica
Technical Library | 2014-09-11 11:43:48.0
In this DOD study the reliability of reworked QFNs is studied with the outcome being that a stay in place stencil does not impact the reliability of a QFN reworked using this technique
Technical Library | 2014-09-11 11:36:46.0
There are a variety of methods one can use to rework QFNs. This paper explains one of the ways to get very little center ground voiding while making it easy to place a tiny component with almost no keep out areas.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
SMT PCBA X-ray Machine ETA-7900 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt x ray,smt x ray machine,x-ray inspection machine,x-ray d
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Wed Mar 08 00:00:00 EST 2017 - Wed Mar 08 00:00:00 EST 2017 | San Diego, California USA
San Diego Chapter - Minimizing Voiding in Bottom-Terminating Components
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes 中文 MEMBERS LOGIN Membership Become a Member