Industry Directory | Manufacturer
Electronic manufacturing solutions and contract manufacturing in sheet metal, PCB assembly, plastics and electromechanical components.
Industry Directory | Manufacturer
The exclusive supplier of SIPAD Solid Solder Deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world.
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. High efficiency multi cutter PCB depeneling machine can directly connect the reflow oven and pick and the pick and place machine on the SMT production line. Th
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
Electronics Forum | Wed Apr 18 08:57:45 EDT 2018 | davef
Here is the IPC Standards Tree [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/SpecTree.pdf ]. The design standards that you ask about are over on the right side. I'd guess that the following standards would be a good starting point: * IPC-2221, "
Electronics Forum | Fri Apr 20 07:32:39 EDT 2018 | stephendo
The biggest factor is the selective solder machine. Do you want to know the minimum distance that all selective solder machines can handle with no difficulty? If so that will be a fairly large distance. If you are designing for in house boards then y
Used SMT Equipment | THT Equipment
Cycle Rate Max 25,000 cph (0.14 sec. per insertion) Reliability 200 ppm or better Component Types Capacitors, resistors, diodes, jumper wire, etc. Component Specs Component Class I Distance Between Tapes 52.4mm +/- 1.5mm (2.063” +/- 0.059”) Pit
Used SMT Equipment | Soldering - Reflow
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Parts & Supplies | SMT Equipment
V-CUT Banding Transportation Machine,PCB Depaneling machine Specifications 1. All PC boards with a V-cut are suitable for the V-CUT PCB separator. 2. It is very easy to operate for the PCB separator. FEATHERS 1. All PC board
Parts & Supplies | SMT Equipment
PCB Separator machine L100 Parameters: 1.maximum of board length: 200mm 2.board thickness:0.4~3mm 3.speed of sending board: it depends 4.material of knife:HSS 5.Volume:580mm(L) ×380mm(W) ×250mm(H) 6.weight:15kg Feature: 1.Minimize the inte
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
http://www.pcb-separator.com/plus/view.php?aid=86 PCB multi cutter machine/high efficiency PCB depaneling 900 machine/ PCB separator
http://www.pcb-separator.com/plus/view.php?aid=86 PCB multi cutter machine/high efficiency PCB depaneling 900 machine/ PCB separator
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Tustin, California USA | Engineering
REI is seeking a bi-lingual (English/Japanese) surface mount technology (SMT) Manufacturing Engineer with printed circuit board (PCB) design and manufacturing experience to join our California Operations Group. The SMT Manufacturing Engineer will de
Career Center | South Plainfield, New Jersey USA | Management,Sales/Marketing
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | new delhi, India | Engineering,Technical Support
Dear Sir/Madam, I would like to take this opportunity of introducing myself to you. I am Software Developer. Presently I am working with Autometers Alliance Ltd. and looking for a better option that gives me a platform where I can utilize my techni
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market Online Version SMTnet Express, October 13, 2016, Subscribers: 26,523, Companies: 14
Blackfox Training Institute, LLC | https://www.blackfox.com/whats-the-difference-between-th-and-smt-soldering/
What's the Difference Between TH and SMT Soldering? - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-microvias-and-printed-circuit-boards/
HDI Microvias & Printed Circuit Boards | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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