Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Education/Training
BEST SMT training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature 0.062in thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This SMT tra
New Equipment | Education/Training
BEST training kits feature REAL circuit boards that represent actual soldering conditions. These training kits feature ".062 thick multilayer boards which are more representative of the thermal conditions of "real" circuit boards. This board feature
Advanced Electronic Contract Manufacturing Services. Full TK Contract Manufacturer, BGA,uBGA, QFN, 0201 and 01005 capabilities.
Contract electronics design and manufacturing service provider specializing in advanced electronic products. ISO-9002 certified and IPC Class II and III capable. Advanced SMT packages including uBGA and 0201 components. Full testing, X-ray inspection
New Equipment | Assembly Services
Assembly on 2 SMT Universal lines . 0201 , uBGA, QFN.
We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.
PCB Assembly 9 SMT lines and 2 DIP lines Min.Chip size:0201 BGA and Bonding are available ROHS compliance Can buy components for customers Capability: 4 million chips can be assembled each day. Our sub-factory one offer PCB assembly service.
We supply OEM and ODM services for PCBA 1)Surface-mounting technology (SMT) and Through –hole/DIP; 2)0201,0402 placement; 3)BGA,CSP,QFP; 4)Burning test ; 5)Full in house design and rapid prototyping for customer; 6)High density interconnected board p
