New SMT Equipment: heat slump (Page 1 of 1)

ALPHA® Epibond® Surface Mount Adhesives

ALPHA® Epibond® Surface Mount Adhesives

New Equipment | Solder Materials

Epibond® 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount

MacDermid Alpha Electronics Solutions

Henkel Chip-on-Board (COB) Encapsulants

Henkel Chip-on-Board (COB) Encapsulants

New Equipment | Materials

Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi

Henkel Electronic Materials

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