Through the years, Fuji has remained committed to creating, developing, and manufacturing the surface mount (SMT) industry's most innovative assembly solutions. Such as the AIMEX IIS. This is a flexible platform for all types of production. Featuring
New Equipment | Test Equipment - Bond Testers
A bond tester that can grow with your company. Future proof performance and flexibility. With the Condor Sigma Lite, XYZTEC gives you a low cost entry point without sacrificing performance to meet future demands. The Condor Sigma Lite is upgradeable
The Finesse� offers a throughput rate of 12,500 CPH with a vast feeder capacity of 198 x 8mm tapes plus Internal Matrix Tray positions in a remarkably compact footprint. This machine incorporates all of the sophistications which are common throughout
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
New Equipment | Test Equipment - Bond Testers
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,
New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
New Equipment | Rework & Repair Equipment
Scotle-HR360 BGA Rework Station Products Description Scotle-HR360 BGA rework station is with 7.2 inch touch screen. Scotle-HR360 applies ARM32 bit microprocessor. Scotle-HR360 can generate profile automatically during reworking process. Scotle
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