Long stencil life, Excellent Printing, Minimum slump, High surface insulation resistance, Long tack life.
New Equipment | Solder Materials
SPA1000 – Solder Paste Analyzer ( slump, tack, wetting, solder ball, spread), all-in-one test.
Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st
New Equipment | Solder Materials
Epibond® 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
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