New SMT Equipment: solder joint partially reflowed (Page 3 of 4)

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

SEHO SelectLine - Flexible Selective Soldering Machine

SEHO SelectLine - Flexible Selective Soldering Machine

New Equipment | Selective Soldering

The PLUS of Flexibility and Precision. Time plays a key role in modern electronic production. With the SelectLine SEHO developed a selective soldering system featuring miniwave processes. Its revolutionary design convinces with highest precision and

SEHO Systems GmbH

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

SEHO MWS 2300 - High-End Wave Soldering Machine

SEHO MWS 2300 - High-End Wave Soldering Machine

New Equipment | Wave Soldering

Maximum flexibility and performance - state of the art full tunnel nitrogen wave soldering system for demanding applications and high production volumes. Based on SEHO's worldwide leading nitrogen technology, the precision machine tooling and the m

SEHO Systems GmbH

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

ALPHA® Solder Paste

ALPHA® Solder Paste

New Equipment | Solder Materials

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications.  Our offering includes leading lead-free, no-clean, halogen-free solder

MacDermid Alpha Electronics Solutions

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

2K - Compact, High-Speed and Affordable AOI

2K - Compact, High-Speed and Affordable AOI

New Equipment | Inspection

The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridges. The 2K Series improve

Vi TECHNOLOGY


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