Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
New Equipment | Coating Equipment
The Select Coat® conformal coating machine provides the highest productivity and quality for your automated coating processes. Automate your conformal coating with state-of-the-art process controls, world-leading know-how, expertise in fluid dynam
AI universal parts 30997607 46737003 SCRAP HOUSING ASSY, OFFSET 46737103 SCRAP HOUSING ASSY, "T" STYLE 46750601 COVER, CLINCH OFF 46750901 COVER, CLINCH VSL 46757801 PICKER AXIS MTR ASSY 46757901 X AXIS MTR ASSY 46758001 Y AXIS MTR ASSY 46758101 ELE
High accuracy, high flexibility for 0201 (0.6mm x 0.3mm),SOIC,PLCC,BGA,,CSP,QFP (0.3mm pitch). Smart feeder ID system provide fast set up and easy programming. Suitable for small & medium volume production. Vision On the Fly Alignment system. Bot
Specially For LED Chip Placement With Vision Centering. APP-N4-1200S is a high-speed LED surface mounting system equipped with four suction nozzles and single-cantilevered SMT head. It reaches the highest speed of 13,000 CPH. Its vision centering sy
(AutoTronik) BS1400 is a very accurate automatic SMT stencil printer. With the powerful AT-align automatic fiducial finding and PCB board offset adjustment system, you can just press the start key, the PCB alignment and printing process will be fully
Automatic Offline Screen Printer The XH STS stencil and screen printing system was specially developed for printing substrates in thick film applications. The flexible system can be used in a wide number of areas within the hybrid, SMT and solar fi
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
