New SMT Equipment: zymet (Page 1 of 1)

Electrically Conductive Adhesives

Electrically Conductive Adhesives

New Equipment | Materials

For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring

Zymet, Inc

Optoelectronics Adhesives

Optoelectronics Adhesives

New Equipment | Materials

Zymet's optoelectronics adhesives are designed for applications such as fiber assembly, connector or ferrule assembly, VCSEL assembly, Bragg Grating assembly, and many others. The adhesives offer the following features: One component, syringe

Zymet, Inc

Non-Conductive Pastes (NCP)

Non-Conductive Pastes (NCP)

New Equipment | Materials

For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati

Zymet, Inc

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

New Equipment | Materials

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to

Zymet, Inc

Thermally Conductive Adhesives

Thermally Conductive Adhesives

New Equipment | Materials

For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi

Zymet, Inc

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

New Equipment | Materials

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline

Zymet, Inc

Anisotropically Conductive Adhesives

Anisotropically Conductive Adhesives

New Equipment | Materials

For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and

Zymet, Inc

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