Electronics Forum | Fri Apr 12 15:10:00 EDT 2002 | jsherrow
IMHO it's caused by three things: 1) placement 2) placement 3) placement
Electronics Forum | Thu Apr 11 16:37:16 EDT 2002 | pteerink
Profile would be the first place I look. Check your rise and fall rates for temp. Should be no more than 2 deg/sec for rise and 4-6 deg/sec for cooling. Phil
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Fri Mar 06 16:17:38 EST 2009 | aj
whats your board finish?
Electronics Forum | Fri Mar 06 02:47:15 EST 2009 | lococost
Have you tried higher peaktemp? I saw the QFP is sn90pb10, This has a liquidus of 268 - 302 C. A good paste should be able to handle 230C (or more), of course you would need to check your other components peak temp.
Electronics Forum | Fri Mar 06 11:01:53 EST 2009 | dyoungquist
I have attached a pdf version of an article that explains the basics of a nitrogen atmosphere when soldering. It gives some basic guidlines as to when one may want to use nitrogen and what it can and can not accomplish. FYI- I did not write that ar
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t
Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro
Electronics Forum | Fri Mar 06 10:50:21 EST 2009 | fountain42
Just my opinion but it look's like your doing a great job. i would try another paste. I'm somewhat lucky that we get to use OA's. If your stuck using the no-cleans they are so tempermental. (The nitrogen is making up for the poor paste) Your de-wetti
