Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef
Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder
Electronics Forum | Tue Jul 06 04:08:11 EDT 2004 | Pad2Pad.com
Hi All, A new version of Pad2Pad 1.3.0 is available for download. It contains multiple new price-time combinations. The list of parts and footprints is extended with DIP sockets, diodes, electrolytic SMT capacitors, popular transistors and ICs. Yo
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
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