Electronics Forum | Thu Jun 19 12:07:09 EDT 2008 | ck_the_flip
You answered your own question! Vapour phase is the way to go for this. Conventional ovens won't allow this, unless you find away to defy Physics. That's an absurd constraint to begin with: 200C. Most Sn-Pb profiles require 205 - 210 minimum for
Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef
Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't
Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw
The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the
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