Electronics Forum | Wed Oct 03 12:02:04 EDT 2001 | kjwaskow
We are getting solder blobs forming in open areas of the BGA, between the center array and outer array. THe ceter array balls are starved of solder, so they are presumably the source. The theory we hold is possible moisture causing the solder to mo
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Fri Oct 27 23:08:58 EDT 2006 | KEN
slow your heating ramp down. You are "tater-chipping" the BGA.
Electronics Forum | Fri Oct 27 07:39:54 EDT 2006 | jdumont
Just wondering if anyone has seen this problem before. We are using a 456 ball FPGA and during installation on our BGA rework machine the corners curl up causing opens there. The part was profiled with our KIC and matches the paste MFG spec. Is this
Electronics Forum | Fri Oct 27 09:05:28 EDT 2006 | jdumont
Thanks a lot for the suggestions. I will try baking and see what develops. For the record the parts are stored in nitrogen atmos. under 5% RH. Doesnt mean they werent overexposed when they got here however... JD
Electronics Forum | Fri Oct 27 08:19:53 EDT 2006 | davef
Josh: Search the fine SMTnet Archives for background discussions. For further discussion on the "being hosed by the physics": http://www.cooksonsemi.com/tech_art/pdfs/Controlling%20Warpage.pdf
Electronics Forum | Fri Oct 27 08:53:25 EDT 2006 | russ
I thjink you should bake these parts for 24 hours at 125C I used to have this problem and I even think it was the same package to be honest. Since we started baking all BGAs for rework process regardless of "condition of storage" we have increased
Electronics Forum | Sat Oct 28 02:25:19 EDT 2006 | mika
Agree!! Where is Your thermocouple-probes attacded and can we get the info from this? Delta-T of the comp. is very, very important! The single most important smt-process step is the profiling/recipy and as a result of this, this poor package will cor
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
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