Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Wed Feb 02 16:24:14 EST 2005 | bobsavenger
I would like to know if anyone has an IPC specification for BGA's handy? I'm looking for specifics based on Classification. Roundness, %voids, size, etc. Please let me know if you have this. Thanks Bob
Electronics Forum | Wed Feb 02 19:45:09 EST 2005 | ybt
try refering IPC-7095 Design and Assembly Process Implementatin for BGAs. I hope it helps.
Electronics Forum | Tue Oct 18 15:50:01 EDT 2022 | smith88
IPC states chips and cracks in glass body are defective if beyond specifications. Chips or cracks in glass body beyond the part specification, see Figure 9-18. • Cracked or damaged glass bead beyond part specification (not shown). On some glass
Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
Electronics Forum | Tue Jul 14 13:23:59 EDT 1998 | Tom
I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. General
Electronics Forum | Fri Jul 10 05:04:51 EDT 1998 | Rob
I am eager to hear from anyone who has experience with X-RAY inspection equipment (specifically for BGA devices) or can make any recommendations. Any knowledge of second hand equipment for sale would also be valuable. Regards Rob
Electronics Forum | Fri Jul 10 13:42:55 EDT 1998 | Bob Willis
| I am eager to hear from anyone who has experience with X-RAY inspection equipment (specifically for BGA devices) or can make any recommendations. Any knowledge of second hand equipment for sale would also be valuable. | Regards | Rob
