Electronics Forum | Tue Jan 29 17:11:32 EST 2019 | slthomas
Your product is Class 3, correct? Otherwise, a clearly wetted connection is all you need.
Electronics Forum | Wed Jan 30 03:01:39 EST 2019 | robl
You could use a stepped stencil around the parts you're having issues with to add a greater paste deposit to them and not the rest, or slightly elongate the apertures and overprint, but this may lead to solder balling.
Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas
In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Thu Sep 06 20:26:07 EDT 2001 | Eric
We see alot of missing component ( on/off ) after chip mounter, and had check on the component height, is correct. Nozzles had change, vaccume strong enough and table height. But we still have missing component.
Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont
I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?
Electronics Forum | Wed Jun 11 10:33:06 EDT 2014 | demzvill
Do you mean that pick up z height is taught too deep thats why it can possibly flip the next chip. I will check our machine if have the same setting as yours. Thank you for this thought.
