Electronics Forum | Wed Oct 29 20:28:59 EST 2003 | davef
The possibilities are dizzying, aren't they? In our dingy fog, if we don't understand your requirement, say so. 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IP
Electronics Forum | Fri Mar 12 07:22:18 EST 2010 | meritajs
Have anyone bought or used AOI OK600 from DEKTEC AUTOMATION? The company that I work for is looking for reliable low cost AOI system
Electronics Forum | Mon May 07 08:46:18 EDT 2001 | CAL
Searching the IPC website is a good start. http://www.ipc.org Some standards you may want to look over are.... IPC 600, IPC 610, J-STD-001 "riveting and circuit cards into metal shelf" definitely has my curiosity level elevated. Since you know your
Electronics Forum | Mon May 07 16:49:59 EDT 2001 | davef
Ashok, What in earthly heaven does this question have to do with "site support"? You can�t always get what you want, but sometimes you get what you need. Some leads are: * The proposed IPC cable/wire harness document is now IPC/WHMA-A-620 and go
Electronics Forum | Tue May 01 20:40:38 EDT 2018 | sarason
In the past I have worked on 600 Amp FET Blocks. The rule was no voids. The circuit board would be heavy copper. 4 times normal plating time. Not particularly high resolution on the board say 20 mils. To help with the heavy plating. The boards were t
Electronics Forum | Thu Mar 11 07:11:26 EST 2010 | meritajs
We are searching for low cost acceptable AOI system. Only one we found for about 20K USD is AOI OK600 from Dektec automation, Chine. Maybe anybody have had experience with such equipment and it support. Any advice in choosing AOI is desirable.
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Fri Jun 02 13:47:06 EDT 2023 | tommy_magyar
The Tucano is easy to use, user friendly menu, easy debugging if there is a problem. The thing is, this one is ages old and had some problems previously which required a near to £10k investment (controller board replacement and some calibration) but
