Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf
How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t
Electronics Forum | Tue May 30 13:50:40 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Tue May 30 17:17:08 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
Electronics Forum | Thu Feb 08 09:41:23 EST 2007 | SWAG
Check the bare board - could also be an unmasked via on the heel of the pad that is sucking solder into it.
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Mon Jan 19 09:49:20 EST 2004 | davef
Not as such. Choices are: 1 Cut and epoxy some board foil from your board fabricator. 2 Sacrifice part a pad repair kits from the likes of: * Engineering Lab 905-785-1982 * Circuit Technology Center 978-374-5000 * General assembly suppliers catalog
Electronics Forum | Wed Sep 19 10:27:03 EDT 2012 | davef
My email mail machine couldn't send this to you ... Hi Stivais ... I didn't read the report. It seems to require downloading of a 'reader' of some sort. No thanks. If you would, just attach the report to this email. Regardless, energy-dispersive X-r
Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
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