Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Fri Jun 06 16:11:25 EDT 2003 | RF Lurker
I understand that there may not be a lot of material on this, as most threads I've seen discourage doing it. It goes against DFM to do it. But I wish to use a large copper area instead of heat sink and thermal epoxy to cool a regulator. But I can'
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Wed Oct 18 07:51:14 EDT 2006 | davef
Look here: http://www.circuittechctr.com/ As a low cost approach, use copper foil purchased from a stained glass window hobbyist shop. Cut foil pieces to size with a sharp knife. Epoxy the pieces in place of the damaged pads. Tin and then solder th
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon
| Hello, | Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e
Electronics Forum | Fri Nov 22 08:57:56 EST 2002 | davef
Q1: What do you mean by "if the board is manufactured properly"? A2: If the epoxy is noy cured prooperly, for instance, the copper will not be well attached to the glass. So, peel strength will be lower. Q2: I don't believe that the peel off/or lif
Electronics Forum | Thu Feb 26 05:57:44 EST 2015 | sarason
To get real conductivity in your traces you will need to remelt your copper or silver tracks. This means 850oC. The other method is plating at low temps, or etching. Epoxies like all carbon based compounds vaporize at 400oC. Next problem epoxy fibre
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