Electronics Forum: enig vs flash gold (Page 1 of 4)

ENIG vs Flash Gold

Electronics Forum | Thu Apr 20 05:57:55 EDT 2006 | Huub

Do you have experience with wear resistance of spring contacts on ENIG vs Flash Au? regards, Huub.

ENIG vs Flash Gold

Electronics Forum | Mon Mar 27 09:54:35 EST 2006 | russ

Flash gold is usually to thick and will cause embrittlement of your solder joints if concentration exceeds I beleive 6% in the joint

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 11:49:44 EDT 2004 | Kris

Hi Guys thanks for the replies. Dave, the spec is not for enig but for hard gold does your response alter if thats the case /

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris

what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help

ENIG vs Flash Gold

Electronics Forum | Sat Mar 25 07:10:12 EST 2006 | davef

We agree with Chris. If your gold is applied properly and is the correct thickness, you will see no difference. One nit on Chris' comments: immersion gold will plate-out [self-limit] around 8 thou, although we've heard 12 thou.

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef

As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

ENIG vs Flash Gold

Electronics Forum | Thu Apr 20 13:42:23 EDT 2006 | fredericksr

I've seen embrittlement %s down to 3%, but a standard 5 mil solder pad would require well over 100uIn of plated gold to cause embrittlement. -Other Russ

ENIG vs Flash Gold

Electronics Forum | Fri Mar 24 15:44:11 EST 2006 | Hoss

I have no experience with soldering to a flash gold finish. We have specified ENIG for a prototype PCB order and the supplier is asking us if they can use flash gold. They are telling us that the two are interchangable which I don't believe. The

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