Electronics Forum: failure mode/mechanism distribution (Page 1 of 2)

GSM Precise Location Failure Rejects

Electronics Forum | Thu Jun 16 03:23:40 EDT 2022 | leaderway0

AI/SMT spare parts and SMT equipment vendors from China-Leaderway Industrial Co., Ltd. The main distribution brands are Fuji, Samsung, Juki, Yamaha, Universal, Panasonic, Siemens, and Sony. Our websites: http://www.leadersmt.com Contact us !!! Email

X7R woes

Electronics Forum | Mon Dec 26 13:31:16 EST 2005 | mariss

Addendum: The boards are 2" by 2.4" (50mm by 60mm) and have 158 SMT components and 20 thru-hole parts. The nine X7R caps are distributed over the board; some are in the middle, others are near the V-grooved board edges. There is no discernable rel

Immersion Silver

Electronics Forum | Sun Jun 06 09:20:03 EDT 2004 | michaeljm

My department and I have been working with immersion silver on and off for about four years and we have compiled quite a bit of data for the Alpha and MacDermid immersion silver chemistries. We have not encountered any assembly or storage related is

Acrylic Coating De-Wetting?

Electronics Forum | Wed Jul 26 11:56:40 EDT 2017 | rgduval

Ah...the joys of subjective analysis! At a glance, these pictures look fine to me. Other than the IC's, which you've indicated were masked, and, maybe R12 in the last picture and CC1384 in the first image, coating looks uniform and well distributed

Re: Popcorn effect with PBGA

Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.

Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an

solder crack

Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef

Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di

Low Silver Solder Problems

Electronics Forum | Mon Aug 24 13:12:28 EDT 2009 | ghepo

OK Eric, maybe you're right. My suggestion is to proceed by exclusion. First perform the tape test. Is easy and without costs. You have used many similar PCB without problem, but from the same vendor ? Is my experience that in similar cases the qua

Film cap losing capacitance?

Electronics Forum | Thu Sep 24 09:28:13 EDT 2015 | rgduval

No direct experience with this particular issue....but, I do know that measuring capacitance can be tricky. How are you arriving at this conclusion? Are you measuring the caps on the bench before assembly, and then on the boards post assembly? Cap

No Clean

Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef

The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o

lead free platings and tin lead

Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef

NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa

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