Electronics Forum | Mon Jul 07 17:25:04 EDT 2008 | thughes
I'm curious to know what the pitch of the outer pads is/was on your device. Also, is this a general formula you use on all of your QFN devices or was this for one specific device?
Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Tue Jul 14 13:23:59 EDT 1998 | Tom
I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. General
Electronics Forum | Sat Aug 25 23:01:45 EDT 2012 | ssridhar
Hello jdumont, I think the spheres are leaning as there is not enough meat under the spheres. In ceramic BGA devices there is a solder fillet which is generally a solder paste which is used to give the device some height before balling it. This heig
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Tue Feb 04 10:18:15 EST 2003 | smsinc
Check out GPD(General Production Devices), they have a tabletop Nitrogen bagger/sealer. 1-800-pick-gpd.
Electronics Forum | Fri Jun 27 10:04:55 EDT 2003 | Charlie Finke
Does anyone know of a good web site that lists general package dimensions for various SMT device sizes, like 1206, etc.?
Electronics Forum | Fri Aug 27 14:59:02 EDT 2004 | anonymous
GPD,General Production Devices has a T&R Peelback Force Tester among their product offerings. 1-800-pickgpd I am not aware of other vendors offerings.
Electronics Forum | Sat Mar 30 05:32:37 EDT 2019 | leeg
How do people generally solder these devices satisfactorily? By hand or machine ? Looks like soldering with an iron could be difficult due to spacing between the pins.
Electronics Forum | Fri Feb 10 13:30:31 EST 2023 | rwyman
Yes, that point remains unchanged. Just a general comment that there have been updates. e.g. re: desiccant re-use, certain devices no longer requiring bake-out, or bake times have been adjusted, and more.
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