Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra
Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Wed Mar 10 09:52:22 EST 1999 | justin medernach
| We are starting up an SMT line with a printer and convection oven.... The area we are considering for the printer is totally uncontrolled for humidity, temperature and even cleanliness. | | We are working on the filters to keep particulates down,
Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse
Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are
Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC
Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center
Electronics Forum | Fri Apr 17 15:06:57 EDT 1998 | Justin Medernach
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper
| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua
Electronics Forum | Mon Jul 01 17:22:27 EDT 2002 | Daan Terstegge
Tg = glass transition temperature, the temperature at which the glass-epoxy starts losing it's properties as a solid material. daan
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
