Electronics Forum | Wed Apr 08 15:40:20 EDT 2015 | kevinb
I would like to find somebody that uses Hysol, (Loctite) material GR 9810-1P. I would like to see how it molds and see if they could part with some of this material for us to try. We are willing to pay for a trial sample. I can go to Hysol but the
Electronics Forum | Tue Apr 17 09:19:11 EDT 2001 | Terry Burnette
Dave, I use Dexter Hysol epoxy 9340 gray. It's a two part epoxy kit. Thermally conductive and electrically insulative. Cures in about 10 minutes at 100C. Terry
Electronics Forum | Fri Dec 16 10:25:37 EST 2005 | solderiron
Rather than cleaning a water soluble flux residue off the board, by encapsulating the product. covering the board or the component with lets say a Hysol encasulant. Would this prevent the active flux residue from migrating and deteriorating the elect
Electronics Forum | Mon Jan 18 15:07:12 EST 2010 | mikesewell
Usually the print specifies the material since the design is qualified with it in place. I've used several from Scotchweld 2216, Scotchweld DP190, Hysol E-20HP, to NASA outgassing qualified Masterbond 10HT.
Electronics Forum | Tue Feb 21 19:14:16 EST 2012 | hegemon
Have had good results with Loctite 3536 and Hysol 4527. The 3536 is easier to use and handle, and can be reworked if needed. I have no relation to, nor receive any benefit from any above mentioned company. `hege
Electronics Forum | Sun Dec 21 04:19:52 EST 2014 | leadthree
When I worked for a company that did alu-wire dice bonding they used a brand called Hysol for encapsuling. It needed heat cure. It's extremely hard to remove. As far as I remember it's epoxy based.
Electronics Forum | Fri Oct 02 06:39:36 EDT 2020 | SMTA-64386317
I am using Bonotek 3400UF and Hysol for underfill application. What is your challenge on underfill process.
Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor
davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro
Electronics Forum | Tue Apr 02 22:52:38 EST 2002 | davef
Tks BT Can't be many places tougher than automotive, 'cept maybe oil field, down pipe. We use Dexter Hysol flow underfills for both 1 thou and 3 thou gaps, but they wouldn't come close to filling under a BGA. Most BGA are sitting about 16+ thou fr
Electronics Forum | Tue Aug 10 14:12:53 EDT 2004 | Fillmore
The alternatives are ink-jet and laser and you'll spend way over $20,000 for that solution! Screen printing is still the best at ROI when doing multiple panels and lot's of legends. We used a rubber stamp inked with Hysol for smaller quantities and o
