Electronics Forum | Fri Nov 05 16:48:28 EDT 2010 | mscalzo3
Please call the Indium Corporation main number ASAP, 1-800-4-Indium, and ask for me, Sr. Tech Support Engineer Mario Scalzo, x7542. Thanks.
Electronics Forum | Wed Dec 06 17:06:06 EST 2006 | Mario Scalzo
For a not-so-technical solution, we have a few customers that are using a Maytag "SkyBox". Available from Home Depot. Like a small soda vending machine, but allows you to control the dispensing. Sincerely, Mario Scalzo-CSMTPE, Dartmouth 6 Sigma G
Electronics Forum | Wed Dec 06 16:34:43 EST 2006 | mscalzo3
The final reflow profile really depends on which of the components are Pb-Free (such as BGA's) and the lowest temperature limit of the components. I'd be glad to share with you some ideas for solving your particular issue. Please contact me offline
Electronics Forum | Thu Nov 04 07:51:41 EDT 2010 | leemeyer
I am in need of a 250 gram jar of Indium Corporation solder paste #81800. This is a tin lead alloy 63/37 with type WMA-SMQ62 water soluable flux. If anyone has an extra jar that is not past it's expiration date please contact me.
Electronics Forum | Fri Sep 06 11:39:06 EDT 2013 | thanh567
Indium Corporation has their plastic spatulas and perfect to use, good on jar and stencil as well.
Electronics Forum | Tue Jun 01 13:38:18 EDT 2004 | cyber_wolf
To maybe simplify, contact David Sbiroli(Apps. Engineer) @ Indium corporation. I have worked with Dave on this issue before. He can most likely get you the info you need. 1-800-4 INDIUM PS: Dave F. : My plasma arc accumulator has unusual carbon sco
Electronics Forum | Wed Dec 06 16:17:31 EST 2006 | Mario Scalzo, CSMTPE
Normally, we try to limit the over print of the paste to the width of the pad on both sides. If you are using 500um pad, then I wouldn't try over a 1500um aperture. Mario Scalzo, CSMTPE, Dartmouth 6 Sigma Green Belt Technical Support Engineer - Ind
Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Tue Mar 17 09:06:25 EST 1998 | Justin Medernach
| | Hi all, | I would like to have some information regarding the paste in holes process.We are the Backplane manufacturing and dealing with lots of thick PCB and would like to change the processes from wave to paste in hole.Any feed back of info
Electronics Forum | Fri Jan 22 17:03:55 EST 1999 | Ross Berntson
| I'm currently planning to do an evaluation of RMA flux solder pastes for mil type applications. Does anyone have any suggestions for vendors to try? I'm especailly interested in pastes that aid application on boards with 20 mil pitch. | I am fro
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