Electronics Forum: n.h. (Page 1 of 1)

Cable assembly

Electronics Forum | Thu Dec 21 13:06:16 EST 2006 | vortex

Hi we are a small contract manufacturer in need of a one time use cable crimping tool DF13-TB2630HC. We only have 3 (4) contact wires to make which will be plugged into another assembly. The p/n we are trying to crimp is DF13-2630SCFA. If you have th

Re: Reflow Temperature Labels/Stickers

Electronics Forum | Tue Jan 12 11:19:16 EST 1999 | marc p

| I've heard about these reflow temperature labels/stickers but haven't seem to find them. Is there such a thing? And how reliable are they? I don't want to keep attaching thermocouple probes onto a board whenever there's a issue. | I am not so fam

Re: Reballing BGA Devices

Electronics Forum | Wed Jan 14 22:47:24 EST 1998 | Ron Costa

I've had demo's on two machines recently. HTI Engineering in Medfeild MA. has a very nice machine. Singularity in Portsmouth N.H. has a very basic , simple machine. You should check tooling costs. If you would like to talk more about it give me a c

Solder Paste Storage and Control

Electronics Forum | Thu Oct 30 11:34:51 EDT 2008 | davem

Guys, So I recently started working for a small CM in Southern N.H. We currently use 2 Magic Chef Mini wine friges to store the solder paste (63/37, RoHS). I've been monitoring the room temp (and humidity) and the frige temps all this week. The pro

SMT Inductor

Electronics Forum | Tue Oct 06 14:27:51 EDT 2020 | kylehunter

> Plenty of 0805 inductors around, up to 470mH, but > nothing that is 26mH. Coilcraft do 23.5mH or 29mH > - see > https://www.coilcraft.com/getmedia/18dd250a-2b92-4 > f9a-bcee-3624995acc0f/0302cs.pdf Eaton do a 27mH > 0805 - s

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

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