Electronics Forum | Mon Mar 16 09:23:56 EST 1998 | Justin Medernach
| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper
Electronics Forum | Thu Nov 13 12:32:12 EST 2014 | jorge_quijano
Hola, I've used the free e-book that I'm attaching when I implement the first Pin in Paste process, it was helpful. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17555&mc=10 One thing that was helpful was also th
Electronics Forum | Thu Jul 18 15:08:36 EDT 2024 | SMTA-64416281
We have an application requiring more than a single preform per component (PIP through hole socket). What we found out is that regardless of how much you overprint, the flux contained in the paste is not enough, so we ended up needing to dispense gel
Electronics Forum | Wed Aug 02 21:36:22 EDT 2006 | Lawrence
Anyone use these for soldering through-hole components? Our comapny is contemplating several options such as preforms,capital equipment like spot soldering equipment and the intrusive reflow system. We are in the process of deciding which strategy we
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Fri Mar 19 18:07:24 EDT 2010 | davef
That's how it's supposed to work, but is working correctly on the components that are loosing heat sinks for you? We have two choices: * Poor solderability of either the component or the heat sink ... OR * Wrong solder preform material
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Mon Jun 09 14:09:06 EDT 2014 | jorge_quijano
Hola... I'm in the middle of a project to reduce assembly time in one of our products, this product has a lot of TH connectors to be soldered by hand, I'm implementing PHIR, first run has been completed, the appearance of the solder joints are obvio
Electronics Forum | Fri Jun 10 19:22:59 EDT 2022 | jdengler
Yes. We only do the side not under the component and do 25 mils if there is enough room. A solder preform is simply a block of solder that is shaped like a SMT component and comes in tape and reel. Most solder manufactures offer these. You can ta
Electronics Forum | Thu Aug 31 04:56:44 EDT 2023 | auriga2001
I would start with the following possibilities and solutions: Add extra solder to the pads with a Camalot dispenser; or preformed solder slugs placed as an additional component if there is enough extra pad to attach it without interfering with compo
winsouce.jpg)
