Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef
No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.
Electronics Forum | Wed Feb 12 13:37:22 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Mon Dec 13 05:43:27 EST 1999 | Wolfgang Busko
Hi Steve, 20 mil pitch shouldn�t be that problem nowadays. In your case bridging and poor wetting seem to go hand in hand. For the poor wetting try to eliminate it by using different paste (higher activated) and work on your profile. Coplanarity also
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Wed Feb 12 12:06:58 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Jul 05 08:11:45 EDT 2007 | naynayno
This is wave soldering process and design question since most folks associated with SMT are processing mixed assemblies. We have a 3-leaded sensor (radial) with such a tight pitch always bridges. Solutions unders disussion are pre-forming and addin
Electronics Forum | Fri Jun 07 10:28:23 EDT 2013 | danselness
We use a Wave Solder Plated Through Hole (PTH) assembly process to install a TO-220 Chip Package in the PCB board that we manufacture and have experienced lower yields on a number of boards with this component due to Bridges. The bridges on the TO-22
Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22
Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb
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