Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef
4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Thu Jan 15 15:16:56 EST 2009 | jsherrow
We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination. We're running a lead free process with aqueous wash. 700 co
Electronics Forum | Thu Jan 15 21:16:18 EST 2009 | davef
Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Tue Oct 02 12:56:41 EDT 2001 | Scott B
We have come across this where the operator was using thin gauge solder wire (more suited to fine pitch SMT soldering) to form large solder fillets (power connections or sheild cans). We found that the operator was feeding large amounts of solder wir
Electronics Forum | Mon Oct 01 16:55:27 EDT 2001 | davef
I agree. Poor soldering technique is the most straightward way of creating solder balls during hand soldering operations.
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