Electronics Forum: solderability mosfets (Page 1 of 2)

Solder void underneath the mosfet

Electronics Forum | Wed Mar 24 10:28:51 EDT 2010 | Sean

Hi all, Anyone used to come across solder void underneath mosfet as shown in the attached file? Will this pose any reliability issue, such as get burnt during functional test? How to over come this problem? As far as I know there is no acceptabl

Solder Voids

Electronics Forum | Thu Aug 14 07:31:54 EDT 2008 | Sean

Hi All, I encountered mosfet with solder voids as shown in the attached file(X-ray photo). Its happen mostly at this power mosfet area..Any idea to eliminate this defect? Thanks in advance, Sean

Solder void underneath the mosfet

Electronics Forum | Wed Mar 24 11:09:44 EDT 2010 | rajeshwara

Hello Sir I faced the same problem for QFP in DTH product in India. IPC stated that void should not be more than 25% of solder joint. But this type of void definatly create problem during functional test. Please check the folloeing point... 1.Check t

Gold contamination: MOSFET lead pre-tinning

Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg

We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w

Solder void underneath the mosfet

Electronics Forum | Thu Mar 25 12:34:26 EDT 2010 | bgaguy

the voids will cause a long term relability problem as the part will not be correctly heatsinked. Change your stencil aperature to a "+" sign 15-20 mils wide in the center of the pad. ___________ : | : : | : :----|----: : | : :__

Solder void underneath the mosfet

Electronics Forum | Fri Mar 26 03:24:01 EDT 2010 | ravikumarasahitec

Hi, yes we used to see this kind of problem our customer end. This due to stencil aperture opening.these kind of issues we will overcome thorough our stencil process. please contact. ravikumar@asahitec.in

Solder void underneath the mosfet

Electronics Forum | Fri Mar 26 09:34:01 EDT 2010 | dyoungquist

What about thermal cycling and/or vibration over the long term? My guess is that with the voids the joint would not be as reliable long term as a joint without the void. Am I thinking correctly?

Solder void underneath the mosfet

Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean

Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat

Solder void underneath the mosfet

Electronics Forum | Fri Mar 26 00:57:05 EDT 2010 | 89jeong

Hello Sir. We also have faced a same problem. At that time, we had to repair it because we could not find any solution. But in our experience, the void underneath FET was more severe whenever we used the FET that have been made long time ago. It is

Mosfet stencil design

Electronics Forum | Mon Jul 18 10:55:26 EDT 2005 | Sylvain

I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming underneath the part. Am currently using a 5 mils with a window design for my stencil. Those anyone have experience or have any suggestion for an aperture th

  1 2 Next

solderability mosfets searches for Companies, Equipment, Machines, Suppliers & Information