Electronics Forum | Fri Nov 10 12:22:12 EST 2000 | casi
I'm interested in probes for wafer testing made in verted. I need to tested wafers with pad with flat gold bumps ( 17um ) with pitch = 70um. I'm also interested in every web site related on gold bumps testing. Thanks a lot !!! Casi
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Mon Nov 14 02:39:39 EST 2005 | lantech
Hello all! Our test adapter have not a plate, which close test probes. We want to do a plate with through holes for test probes and holes for guiding and centring pins. We want to order a making this one. Adapter is MTS180. Thanks.
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Wed Jan 04 14:59:41 EST 2006 | AOI
I have used all of test and inspection techniques available out there: AOI, AXI, Flying Probe, ICT, and FCT. The reality is that they all have a place in manufacturing based on the type and complexity of product you bild, the industry it is intended
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Fri Apr 29 09:08:45 EDT 2005 | davef
We call this the "orange stick test", but who's coloring? In preforming the test, you're supposed to use a light touch. Unfortunately, it's difficult to calibrate a "light touch." So, operators often end-up using too much force when probing or usi
Electronics Forum | Thu Apr 16 22:15:42 EDT 2009 | davef
For general flying probe test guidelines, look here: http://www.testcoachcorp.com/finnProducts/downloads/DFT/DFT.pdf For specific guideles, follow the advice of your equipment supplier. We have no relationship, nor receive benefit from the company
Electronics Forum | Wed Apr 15 10:27:20 EDT 2009 | mbohuslav
I am trying to find out what would be considered the minimum test via that would be considered reliable for Flying Probe testers. Specifically Javelin testers. Also what would the minimum annular ring need to be.
Electronics Forum | Mon Jan 31 08:30:41 EST 2005 | davef
Yes, probing via is perfectly acceptable. Via: * Pad diameter is 0.028 inch * Via pitch minimum is 0.50 inch ... all of which is fairly common, even when probing test pads. [Your English is fine, at least as good a half the English speakers here.]
