Electronics Forum | Wed Jan 30 06:08:09 EST 2002 | nifhail
Can someone pls help to explain what is the vapour phase reflow soldering technology ? Thx, nifhail
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Fri Feb 01 10:57:52 EST 2002 | davef
Yes, that's what people are thinking. The 217�C melting temperature that you mention requires a ~250�C reflow temperature. Generally, boards, legend ink, and components cannot take that temperature. Further, few ovens can produce that temperature
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Wed Jan 30 17:48:31 EST 2002 | davef
Expanding on a previous poster's comments ... Vapor Phase Soldering. A solder reflow technology that uses a heated solvent to melt the solder. Buried deep in the recesses of the SMTnet Library is �Terms & Definitions�. We started using vapor phas
Electronics Forum | Tue Aug 18 17:40:52 EDT 2009 | jlawson
Is the mechanics ok with the raising and lowering into the vapour ie no small movements that could be moving the part ? Most Vapour Machines have a lower and raise mechanisim so movemnt of parts can happen if not smooth, especially when coming out o
Electronics Forum | Thu Aug 20 07:46:55 EDT 2009 | sergey2007
This is a picture of the board without components.
Electronics Forum | Wed Aug 26 03:21:00 EDT 2009 | sergey2007
Hi Graham, the MSD level of the component is 3. I am not sure that my customer properly stored the component before the soldering process. And I am not sure that it was dried at all. The customer says they did everything that they had to, but I just
Electronics Forum | Wed Aug 19 16:07:58 EDT 2009 | davef
We don't know dip about vapor phase soldering, but we can't help but wonder how well the leads of the component match with the pads on the board.
Electronics Forum | Thu Aug 20 19:07:29 EDT 2009 | smt_guy
reduce the stencil aperture to prevent tombstoning in vapor phase process. from my experience a 6 mil thick must be at least between 20 to 30 % aperture reduction for 0805's and below. cheers!
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