Partner Websites: 0201 clean rate (Page 1 of 30)

VI Technology AOI

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_vitechnology_aoi.html

: Benchtop Automated Optical Inspection Max. PCB Size: 20" x 18" Min. PCB Size: 1.96" x 1.96" Lead Free Capable Inspects Components: 0201 up to exotic Vectoral Imaging - Pixel size

1st Place Machinery Inc.

Philips ACM

1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_pickandplace_philipsacm.html

Philips ACM   Philips ACM Micro Placement Machine   ID Number: M17570 Year 2000 Component Types: BGA, CSP, Flip Chips, Odds, Connector Optimal Run Rate

1st Place Machinery Inc.

Steadi-Mix 2K Compact Motorized Power Mixer| Nordson Sealant Equipment

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sealant-equipment/products/meters-and-metering-systems/steadi-mix-2k

  Steadi-Mix 2K Literature   Steadi-Mix 2K   Steadi-Mix 2K Compact Motorized Power Mixer Easy-to-clean design provides adjustable mix capabilities and optimized flow paths for pressure-sensitive (syntactic

ASYMTEK Products | Nordson Electronics Solutions

S3X58-HF1100-3 - 600 gm - PCBASupplies

| https://pcbasupplies.com/s3x58-hf1100-3-600gm/

@PCBASupplies.com with questions. Categories: Solder Paste , Solder Brand: Koki Description Additional information Description S3X58-HF1100-3 – 600 gm Type-4 No-Clean Halogen Free Lead-Free SAC305 Solder Paste The Definitive Solder Paste, Unveiled

S3X58-M650-7 - 600 gm - PCBASupplies

| https://pcbasupplies.com/s3x58-m650-7-600gm/

– 600 gm Type-4 No-Clean Halogen Free Solder Paste - Lead-Free SAC305 ICT Solder Paste Good inspection properties S3X58-M650-7 halogen free solder paste prevents the buildup of thick and sticky flux

Voidless / Vacuum Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23565&url=_print

. Nitrogen Inert Atmosphere To 10 PPM with 50% reduction in N2 consumption ! Fitlerless Flux Separation System Water Cooling Option To Increase Cooling Rate "Easy Clean" Mode That Only Takes 30 Minutes Oxygen Monitoring With Closed Loop Control for tightest process control

DDM Novastar Pick and Place Archives - Lewis and Clark, Inc.

Lewis & Clark | https://www.lewis-clark.com/product-tag/ddm-novastar-pick-and-place/

: 13.5″ x 22″ Smallest Component Capacity: 0201 Components Largest Component Size:  1.96″ Square Body Placement Accuracy: ±0.001″ (0.025mm) Max Placement Rate: 3000 cph Fine Pitch Capability

Lewis & Clark

How to Prevent Non-Wetting Defect during the SMT Reflow Process-SMT Technical-Reflow oven,SMT Reflow

| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print

. Solder wetting behavior can be significantly improved by using nitrogen in the reflow oven environment. For the 0201 and 01005 package components, decrease the pre-heat slope rate

Precision Auger Pump

GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-precisionauger.php

. The selection of auger diameter and cut are based on specific application requirements, dispense quantity, and dispense rate. Any auger/cartridge configuration can be inserted into the main Precision Auger Body without modification

GPD Global

Precision Auger Pump

GPD Global | https://www.gpd-global.com/fluiddispense-prod-precisionauger.php?utm_source=PAnewsINT08_2016

. The selection of auger diameter and cut are based on specific application requirements, dispense quantity, and dispense rate. Any auger/cartridge configuration can be inserted into the main Precision Auger Body without modification

GPD Global

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