ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/applications/dispensing-cold-materials-and-adhesives
Dispensing - Cold Materials & Adhesives | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/applications/dispensing-cold-materials-and-adhesives?page=1
Dispensing - Cold Materials & Adhesives | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/test-types/cold-bump-pull?page=1
Cold-Bump-Pull Test| Nordson DAGE X-Ray Inspection and Test Products Corporate | Globale Standorte (Englisch) | Sprachen Nur Sparte Alles von Nordson Home Produkte Bondtest Systeme Mikro Werkstofftester Wafer Inspektion und Messung X-ray Inspektion X-ray
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/applications/dispensing-cold-materials-and-adhesives?con=t&page=6
Dispensing - Cold Materials & Adhesives | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
/Corner, 311 Cycles, BGA256 Figure 26. Cross Sectional View, BGA Void Assessment: 31.3%, Inner Row/Corner, 311 Cycles, BGA256 Figure 27 illustrates a typical solder joint containing a 12% void in a BGA solder joint that did not fail the thermal cycling test
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
/Corner, 311 Cycles, BGA256 Figure 26. Cross Sectional View, BGA Void Assessment: 31.3%, Inner Row/Corner, 311 Cycles, BGA256 Figure 27 illustrates a typical solder joint containing a 12% void in a BGA solder joint that did not fail the thermal cycling test
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/dispensing-cold-materials-and-adhesives?page=11
Support Suppliers Resources Careers Home Application Dispensing - Cold Materials and Adhesives Cold Liquid and Adhesive Dispensing Solutions Find quality cold liquid and ambient temperature dispensing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/dispensing-cold-materials-and-adhesives?page=8
Support Suppliers Resources Careers Home Application Dispensing - Cold Materials and Adhesives Cold Liquid and Adhesive Dispensing Solutions Find quality cold liquid and ambient temperature dispensing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ko-KR/divisions/efd/applications/dispensing-cold-materials-and-adhesives?page=4
공정에도 대응하도록 배합되어 BGA 재작업, 모바일 기기 수리, 리플로우 솔더 페이스트 등에 적합합니다. OptiSure™ 자동 광학 검사(AOI) 용착 요구 사항이 충족되었는지 확인할 수 있도록 유체 용착 치수와 용착 위치에 대한 광학적 보증을 제공합니다. PICO Pµlse 접촉식 디스펜스 밸브 PICO Pµlse 접촉식 디스펜스 밸브를 사용하면 선과 줄무늬 시작 및 끝 부분에서 충격을 없앨 수 있습니다. 다양한 디스펜스 팁과 함께 사용하십시오
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic801&OB=DESC.html
– Fixed a bug that was causing through-hole parts to fail FPX File Update – Created new BGA FPX in IPC folder and updated SM & FPE FPX files NEW: DFN 2-pin – Added Inductors, Resistors and Capacitors
